Light emitting diode light source for curing dental composites

ABSTRACT

Light Emitting Diode Light Sources for Dental Curing are disclosed. Some embodiments of the invention include structures such as Light Emitting Diode Array(s), heat sink, heat dissipation, heat pipe, and control circuitry are disclosed.

BACKGROUND OR THE INVENTION

[0001] This invention relates to the use of Light Emitting Diodes (LEDs)as a light source for curing dental composite materials.

THE BACKGROUND ART

[0002] Light Emitting Diodes produce a narrow bandwidth of light outputwavelengths. Because dental composite materials require specific andnarrow bandwidths of light to polymerize correctly attempts have beenmade to utilize Light Emitting Diodes in dental curing lights.Furthermore, Light Emitting Diodes produce no infrared energy and,thereby, produce no heat that can be radiated to the patient.Unfortunately, current Light Emitting Diodes, that produce the bluewavelengths requisite to cure dental composites, have a low power output(on the order of 5 milliwatts total blue light output). Furthermore, itis only possible, with current technology, to deliver about 30-40% ofthe light produced to the dental material. A threshold of about 100milliwatts is necessary to begin the curing process on most dentalcomposites. Therefore, a number of diodes must be used to achieve outputpowers that will cure the dental composites. Further complicating thetechnology is the low overall efficiency of the Light Emitting Diodes;they are about 6% efficient. Meaning that in order to receive 5milliwatts in optical energy one must expend 80 milliwatts of electricalenergy. The difference in energy in versus optical energy out isdissipated in the form of heat. For every 5 milliwatts of optical energyproduced a curing device must dissipate 75 milliwatts worth of heatgenerated within the Light Emitting Diode.

[0003] LumaLite, Inc. of Spring Valley, Calif. has invented a LightEmitting Diode curing light, brand named the LumaCure. This light iscomprised of 7 Light Emitting Diodes which produce, in idealcircumstances, 35 milliwatts of optical curing energy which isinsufficient to hit the threshold of 100 milliwatts and as a result doesnot cure dental composites. Dental/Medical Diagnostic Systems, Inc. ofWookland Hills, Calif. has invented a Light Emitting Diode curing lightthat contains over 60 Light Emitting Diodes, however, the device isincapable of dissipating the 4500 milliwatts of thermal energy producedfor more than a few seconds, therefore, the device has been found indentistry to be of little clinical value. Inventor John Kennedy hasinvented several designs (U.S. Pat. Nos. 5,420,768,/5,420,768/5,233,283)of Light Emitting Diode dental curing lights. None of the designsadequately manage the heat produced by the Light Emitting Diodes and,subsequently, no working models have been introduced to commerce.Inventor J. Martin Osterwalder has invented a Light Emitting Diodedental curing light (U.S. Pat. No. 6,102,696) which containsinsufficient numbers of Light Emitting Diodes to hit the dentalcomposite curing threshold and has no provision for dissipating the heatproduced by the Light Emitting Diodes, subsequently, no working modelshave been introduced to commerce utilizing the design.

OBJECTS OF THE INVENTION

[0004] It is an object of the invention to provide a Light EmittingDiode (LED) light source for the curing of dental composite materialsthat has sufficient power to cure the material and adequate heatmanagement structures to avoid heat damage to the curing light itselfand the patient.

[0005] Additional objects, features and advantages of the invention willbecome apparent to persons of ordinary skill in the art upon reading thespecification in light of the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006]FIG. 100 depicts the side view and top view on a single LightEmitting Diode.

[0007]FIG. 200 depicts the side view and top view of a Light EmittingDiode placed in a reflective cup.

[0008]FIG. 300 depicts ideally light being emitted from the LightEmitting Diode and then being reflected by the reflective angledsurfaces of a reflective cup.

[0009]FIG. 400 depicts realistic light emission from a Light EmittingDiode.

[0010]FIG. 500 depicts light being generated by a Light Emitting Diodeand being reflected by a curved surface reflective cup.

[0011]FIG. 600 depicts light being generated by a Light Emitting Diodeand being reflected to a specific focal point from a curved surfacereflective cup.

[0012]FIG. 700 depicts an array of 144 Light Emitting Diodes placed in144 separate reflective cups.

[0013]FIG. 800 depicts a side view of FIG. 700 depicting curvedreflective surfaces of the individual cups.

[0014]FIG. 625 depicts a Light Emitting Diode array set in a square cupwith an angled reflective surface at the top of the cup. Additionalfocusing/columniation provided by an array of lenses. Electricalconnections of the Light Emitting Diodes is also depicted.

[0015]FIG. 650 depicts a Light Emitting Diode array placed in curvedcups with further focusing/columniation provided by an array of lenses.Electrical connection of the Light Emitting Diodes is also depicted.

[0016]FIG. 675 depicts a Light Emitting Diode array placed in ellipticalcurved cups with further focusing/columniation provided by an array oflenses. Electrical connection of the Light Emitting Diodes is alsodepicted.

[0017]FIG. 900 depicts an array of 4 Light Emitting Diodes being placedin a single cup with angled reflective walls.

[0018]FIG. 1000 depicts an array of 12 cups (angled or curved wall) with4 Light Emitting Diodes in each cup. Further depicted is the electricalisolation of the cup arrays; they are electrically isolated in groups of4 cups.

[0019]FIG. 1100 depicts an array of Light Emitting Diodes placed inangle walled cups which are arranged in a curved shape.

[0020]FIG. 1105 depicts an array of Light Emitting Diodes placed inangled reflective walled or curved reflective walled trenches.

[0021]FIG. 1110 depicts an array of Light Emitting Diodes that areplaced in cups as well as trenches.

[0022]FIG. 1115 depicts a large array of Light Emitting Diodes that areplaced in cups (singularly or in groups) which are electrically isolatedfrom each other in quarters.

[0023]FIG. 1120 depicts a less dense array of Light Emitting Diodes, incups and electrically isolated from each other in quarters.

[0024]FIG. 1130 depicts an array of Light Emitting Diodes comprised of 2separate types of Light Emitting Diodes which are placed in angle orcurved reflective wall trenches. Electrical isolation of the twodifferent types of diodes as well as their electrical connection is alsodepicted.

[0025]FIG. 1150 depicts a closely compacted Light Emitting Diode arrayplaced in individual angled or curved reflective wall cups. Quarteredelectrical isolation is also depicted.

[0026]FIG. 1155 depicts a less tightly compacted array of Light EmittingDiodes placed in single angled or curved reflective wall cups. Quarteredelectrical isolation is also depicted.

[0027]FIG. 1160 depicts a Light Emitting Diode array placed in angled orcurved reflective wall trenches. Halved electrical isolation is alsodepicted.

[0028]FIG. 1165 depicts a tightly compacted array of Light EmittingDiodes placed in single angled or curved reflective wall cups with noelectrical isolation.

[0029]FIG. 1200 depicts an array of Light Emitting Diodes in reflectivewalled cups with an array of focusing/columniation lenses depicted.

[0030]FIG. 1300 depicts an array of Light Emitting Diodes in reflectivewalled cups with a single lens providing addition focusing/columniation.

[0031]FIG. 1400 depicts an array of focusing/columniation lenses placedover a single reflective wall cup.

[0032]FIG. 1500 depicts an array of large focusing/columniation lensesplaced over an array of Light Emitting Diodes placed in reflectivewalled cups.

[0033]FIG. 1600 depicts an array of Light Emitting Diodes placed insingle reflective wall cups sealed with a single optical,non-focusing/collimating window.

[0034]FIG. 1700 depicts an assembly of a Light Emitting Diode array, aheat transfer device (heat pipe) and a heat dissipating device (heatsink).

[0035]FIG. 1750 depicts an assembly with electrical connections wherethe heat transfer/heat sink assembly is also an integral electricalconnection (anode).

[0036]FIG. 1800 depicts water cooling assembly for the Light EmittingDiode array.

[0037]FIG. 1850 depicts an assembly which first transfers the heat byway of heat pipe and then removes the heat by way of circulation water.

[0038]FIG. 1900 depicts a machinist drawing for constructing a LightEmitting Diode array for a Light Emitting Diode dental curing lightsource.

[0039]FIG. 1910 depicts a machinist drawing for constructing a LightEmitting Diode array for a Light Emitting Diode dental curing lightsource.

[0040]FIG. 1920 depicts a machinist drawing for constructing a LightEmitting Diode array for a Light Emitting Diode dental curing lightsource.

[0041]FIG. 1930 depicts a machinist drawing for constructing a LightEmitting Diode array for a Light Emitting Diode dental curing lightsource.

[0042]FIG. 1940 depicts a machinist drawing for constructing a LightEmitting Diode array for a Light Emitting Diode dental curing lightsource.

[0043]FIG. 2000 depicts a machinist drawing for constructing the heatsink (air) for a Light Emitting Diode dental curing light source.

[0044]FIG. 2010 depicts a machinist drawing for constructing the heatsink (air) for a Light Emitting Diode dental curing light source.

[0045]FIG. 2020 depicts a machinist drawing for constructing the heatsink (air) for a Light Emitting Diode dental curing light source.

[0046]FIG. 2030 depicts a machinist drawing for constructing the heatsink (air) for a Light Emitting Diode dental curing light source.

[0047]FIG. 2100 depicts and assembly drawing to assemble a LightEmitting Diode dental curing light source.

[0048]FIG. 2110 depicts an assembly drawing to assemble a Light EmittingDiode dental curing light source.

[0049]FIG. 2200 depicts an electrical schematic to construct a circuitwhich would modulate the Light Emitting Diode array of a Light EmittingDiode dental curing light source.

[0050]FIG. 2300 depicts an electrical schematic to construct a circuitwhich would drive the Light Emitting Diode array of a Light EmittingDiode dental curing light source.

[0051]FIG. 2400 depicts an electrical schematic to construct a circuitwhich would charge the batteries of and allow AC (plugged into the wall)operation of a Light Emitting Diode array of a Light Emitting Diodedental curing light source.

[0052]FIG. 2500 depicts an electrical schematic to construct the ACpower supply for a Light Emitting Diode array for a Light Emitting Diodedental curing light source.

[0053]FIG. 2600 depicts an assembly drawing for the cooling layout of aLight Emitting Diode dental curing light source where the cooling isaccomplished by water circulation or phase change heat effussionmaterial.

[0054]FIG. 2700 depicts an assembly drawing for a Light Emitting Diodedental curing light source.

[0055]FIG. 2800 depicts and assembly drawing for a Light Emitting Diodedental curing light source.

[0056]FIG. 2900 depicts an assembly drawing for a Light Emitting Diodelight source.

[0057]FIG. 3000 depicts an assembly drawing for a Light Emitting Diodelight source.

DETAILED DESCRIPTION OF SOME EMBODIMENTS OF THE INVENTION

[0058] The invention first takes the LED as an electronic componentwithout any lenses or wires attached, FIG. 100. The LED is essentially acube with dimensions on the order of 0.250 millimeters, FIG. 100. On thetop surface is an Anode (101). The bottom surface is metallized andserves as the Cathode and the heat transfer point/medium (102). The LEDalso contains a layer of semiconductor that is doped with specificmaterials in specific concentrations to produce the desired wavelengthof light (103). Finally, the LED contains a layer of semiconductorsubstrate (104). When electrical current is passed between the cathode(102) and the anode (101), photons of a particular wavelength (dependingon the composition of the materials) are emitted from the dopedsemiconductor layer (103).

[0059] Secondly the invention places the LED or LED array on one side ofa flat substrate in all configurations of the invention the substrate isboth electrically and thermally conductive. This provides the inventionwith two unique and superior feature; the heat is immediately removedfrom the LED and the heat removing/transporting substrate becomesintegral with the anode of the LED hence serving as a heat removaldevice and electrical connection. It is also useful to the invention toplace the individual LED into a reflective ‘cup’ which reflects theomnidirectional emitted photons into a single direction, FIG. 200. Inthe simplest of the invention's cup designs (200) the walls of the cup(201) are manufactured such that they are on a 45 degree angle. FIG.300, for this design the photons are emitted, theoretically andidealistically, out of the top of the LED and in a horizontal plane(301) from the side of the semiconductor layers (302), the 45 degreeside wall (303) would, theoretically and idealistically, reflect theemitted photon and redirect it in one direction 90 degrees from itsorigin (304). However, in practice, FIG. 400, LEDs emit photons (401) inall directions. The invention improves the efficiency of reflection byproviding additional cup designs such as a cups containing hemispheric,elliptical or parabolic curve. FIG. 500, the elliptical cup (501),because of its curved surfaces reflects omnidirectional photons (502)into one directional photons (503). Furthermore, FIG. 600, by adjustingthe altitude of the LED within the ellipse (601) the invention allowsfor the omnidirectional photons (602) to be reflected to a specific,predetermine, focal point in space (603). The engineer utilizes the wellknown optical equation 2/Radius=1/Focal Point+1/Optical Source to designhemispherical shaped cups and the well know optical equation X²=4 PY todesign Parabolic and Elliptical shaped cups. By engineering specific cupshapes and engineering specific placement of the LED within the cup, theinvention allows the majority of photons produced by the LED to beplaced at a specific point in space where they are needed. Additionalcup designs that are useful to the invention (with or without the lensesillustrated) are illustrated in FIGS. 625, 650, and 675. The specificexamples of cup design listed above are not intended to be restrictiveto the invention in any way, for instance, a pyramidal (upside down)design as been suggested. The descriptions are simply given toillustrate the potential of specific cup designs. The actual design ofthe cups would be varied and specific to the application.

[0060] Thirdly the invention assembles many LEDs into arrays in order toachieve higher optical output powers than are achieved with a singleLED. FIG. 800, the invention provides for single LEDs placed in a manycup array. However, the invention is not restricted to thisconfiguration. FIG. 900, in the invention the array can be accomplishedby placing a number of LEDs within the same cup. Furthermore, theinvention also utilized an array of LEDs in each cup coupled with andarray of cups, FIG. 1000. In FIG. 1000 there are 4 single LEDs per cupand an array of 16 cups in a circular pattern. The invention is notlimited to circular pattern arrays (1000) and square pattern arrays(800), indeed, the pattern of the array is only limited to the potentialapplication. Furthermore, the description of single LEDs in a cup (800)or an array of 4 LEDs in a cup (900) is not meant to restrict theinvention to these two descriptions, again, the number of LEDs arrayedper cup is only limited by the application to which it is intended. Itis also useful to the invention to manufacture various shapes into whichthe cups are machined or stamped, FIG. 1100. In this configuration(1100) the invention takes advantage of the light reflecting design ofthe cup and further enhance these properties by positioning the cupsthemselves in a dish shaped plate. This illustration is not meant torestrict the usefulness of the invention to a flat shaped array of cups(800) and a dish shaped array of cups (1100), on the contrary, it ismeant to illustrate the complexity that can be incorporated by theinvention in order to suite the particular needs of an application.FIGS. 1125 and 1150 illustrate additional arrays and ‘cup’configurations that are useful to the invention. FIG. 1125 illustratesarray configuration in which many LEDs can be placed in arrays that areapproximately ½ inch in diameter. 1126, 1127, and 1128 are illustrationsof cup designs that are in a ‘trench’ format, where the sides of thetrench are designed in an angled or curved shape. FIG. 1150 illustratesarray configurations win which many LEDs can be placed in arrays thatare approximately 1.5 inches in diameter. 1151 utilizes the trenchrather than individual cup design. Again these examples are not meant tobe restrictive. They are meant to illustrate some of the many potentialarray/cup designs that are useful to the invention.

[0061] Fourthly, the invention makes use of single lenses, including butnot limited to Graded Index of Refraction (GRIN) lenses, lens arrays,including but not limited to Graded Index of Refraction (GRIN) lensesand holographic films, including but not limited to Graded Index ofRefraction (GRIN) lenses in order to further process the light anddeliver it, in its most useful quantities and qualities, to the specificapplications. FIGS. 625, 650, 675, and 1200, the invention provides forthe use of miniature lenses or holographic films (1201) placed directlyover the individual cups (1202) forming an array of lenses orholographic films. FIG. 1300, the invention also allows for the use of asingle lens or holographic film (1301) to be placed over the entirearray of cups (1302). FIG. 1400, it is also useful to the invention toprovide an array of lenses or holographic films (1401). The array oflenses or holographic films could contain many lenses, many films or acombination of lenses and films. Furthermore, it is useful to theinvention to place these arrays over a single cup as illustrated in FIG.1400 but it is also useful to the invention, FIG. 1500, to place a placean array of lenses (1501) and/or holographic film(s) over an array ofcups (1502). Whether or not lenses or holographic films or arrays oflenses and/or holographic film(s) are used, it is useful to theinvention to seal the LEDs, singularly or in an array, to protect themfrom environmental conditions that are adverse to their operation. FIG.1600, an appropriate sized piece of anti-reflective (AR) coated opticalglass (1601) is placed over the array (1602) and secured withultraviolet light cured optical adhesive (1603) thus protecting the LEDsfrom adverse environmental conditions. The discussion and exampleslisted by way of lenses, holographic films and sealing windows (opticalglass) are not intended to restrict the invention to the describedscenarios but is rather to illustrate some of the many potentialconfigurations that are useful to the invention. For instances, it hasbeen suggested that micro ball lenses could be used for particularapplications. The configuration of lenses, holographic films and sealingoptics are only limited to the dictation's of the particularapplication.

[0062] Fifthly, the invention facilitates the removal thermal energyfrom single LEDs in a flat mounted configuration or in a single cup orfrom arrays of cups with single LEDs or from arrays of cups thatindividually contain arrays of LEDs while it maintains electricalinsulation and conductivity where appropriate. Cup is defined in thecontext of this patent as a “shaped hole” in which a single LED or anumber of LEDs can be placed. The word cup, as used in this invention,refers to any configuration that could accept an LED or LEDs. FIGS. 1120and 1115 illustrate cups that are circular while FIGS. 1105, 1110 and1130 illustrate cups that are formed in a ‘trench’ configuration. Thereis no shape constraints to the definition of cup in this invention,however, all cup designs have angled, curved, square or combinations ofangled, curved or square walls designed to gather and reflect thephotons produced by the LED toward the surface where the photons areneeded. FIG. 1700, the cup housing may be manufactured from a thermallyand electrically conductive material (substrate) such as copper and isplated with optically reflective, thermally conductive and electricallyconductive material such as first nickel and then rhodium, or silver(1701). The LED(s) then may be secured to the bottom of the cup(s) usinga thermally and electrically conductive adhesive such as silver filledepoxy (1702). The separate sections of LED/cups (1703) are then bondedto a plate made of heat conducting material (substrate) such as aluminumor copper (1710) with a space between the cup sections (1704) to provideelectrical isolation. They are bonded to the plate using a thermallyconductive but electrically insulating adhesive such as Thermal Epoxy,Electrically Insulating (1705). The LED(s) are then electricallyconnected by soldiering or conductively bonding the gold wires to thecontacts (1706) and connecting them in series to the next electricallyisolated cup(s) (1707). A gold wire is then soldiered or bonded to thecontact of the last LED(s) (1708) in the series and is taken out toconnect to the positive side of the direct current power source (1709).A gold wire is then soldiered or bonded to the cup material of the firstLED(s) (1711) in the series and directed toward the negative side of thedirect current power source (1712). Optical adhesive such asUltra-Violet Activated Optical Adhesive is placed around the tops of thecups (1713), the gold wire leaving the last in the series of LED(s) isthen embedded in the optical adhesive (1714) to provide electricalinsulation. The optical window (or lenses, holographic films or arraysof lenses and/or holographic films and/or optical windows) (1715) isthen position and set into the optical adhesive (1713) and the opticaladhesive is cured with an ultra-violet light source. This assembly isthen soldiered or bonded (using a thermally conductive adhesive) (1716)to a heat pipe (1717). The heat pipe is then soldiered or bonded to aheat sink (1718) manufactured from a thermally conductive materialdesigned to dissipate heat in to a heat dissipation environment such asaluminum or copper. The heat dissipation environment is an environmentthat conducts the heat away from the heat sink such as air, water, phasechange heat effusion material or a combination of air, water, and phasechange heat effusion material. The heat sink is then secured to achamber (1719) which houses either the direct current power supply,batteries to supply direct current or facilitates connection to anoutside direct current power supply. This chamber is then connected to afan (to move air, water and or phase change heat effusion material(1720) if additional cooling is requisite for the application. Thisdiscussion of configuration is not restrictive to the invention. Indeed,the usefulness of the invention for an application, in large part, isdue to the inventions ability to be easily configured for specificapplications. For instance it has been suggested that rather than havingan electrically conductive plating placed on the cup material (1703)that an optically reflective plastic coating be used instead. In thisconfiguration an electrically conductive substrate would be placed atthe bottom of the cup (1702) between the cup and the LED(s), both beingsecured with electrically conductive epoxy. Another solution would be tomask the bottom of the cup before plastic coating then remove the maskand epoxy the LED in place as described earlier.

[0063] The LED(s) need not be wired completely in series. That is to saythat you could build a pie shaped (square or round) device that hasarrays of LEDs and cups in sections of the pie, FIG. 1000 illustratessuch a scenario or configuration. In FIG. 1000 there are 4 sectionswhich contain 4 cups each. Each cup contains 4 LEDs. In such a case thenegative side of a direct current power source would be attached to oneof the sections of cup material. The electrical connectors of each ofthe sixteen LEDs in this first section would have gold wires soldieredto them and each of these wire would then be soldiered to the next, orsecond, section of the cup material. The electrical connectors of eachof the sixteen LEDs in this second section would have gold wiressoldiered to them and each of these wires would then be soldiered to thenext (third) section of the cup material. The electrical connectors ofeach of the sixteen LEDs in the third section would have gold wiressoldiered to them and each of these wire would then be soldiered to thenext (forth) section of the cup material. The electrical connectors ofeach of the sixteen LEDs in the forth section would have gold wiressoldiered to them and each of these wire would then be directed to thepositive side of the direct current power source. In effect and actuallythis would produce a series circuit which contains 4 series of 16 LEDswired in parallel.

[0064] The substrate used to manufacture the cups (1703) may be made ofthe same material used to manufacture the substrate for heat removal(1710) making it an integral one piece assembly, refer to FIGS. 1910,1920, 1930 and 1940. In this configuration the substrate is an integralheat sink. Electrical isolation is accomplished by bonding a copperconductive sheet using nonconductive epoxy to the top surface of thesubstrate and wire bonding the LEDs' cathodes to the copper conductivesheet, refer to FIG. 1930. In this electrical configuration thesubstrate conducts heat away from the LEDs while conducting electricalcurrent to the anode, electrical current is supplied to the cathode byway of a sheet of copper that has been secured with non-conductive epoxyto the top of the substrate. Furthermore, the design of FIG. 1130incorporates two electrical circuits (1133, 1135) which are electricallyisolated by machined paths (1134, 1131). This allows two separate typesof LEDs (for instance 430 nanometer and 450 nanometer) to beincorporated into the same curing device. This design is incorporatedinto the proto-type that was constructed and tested and is the subjectof the example below.

[0065] Another configuration useful to the invention would eliminate theheat pipe and provide a heat dissipation environment directly in thesubstrate. Refer to FIG. 1800. 1801 is a heat dissipation environmentchamber which allows the heat dissipation environment material (air,water, phase change heat effusion material, or combination thereof) tosimple absorb the heat while being stored in the chamber or may becirculated through the chamber between port (1802, 1803). As is theconfiguration discussed above the substrates in this configuration canbe separated as depicted or may be integral, made of the same materialwith no separation, providing heat removal, heat dissipation andintegral anodic electrical connection. Yet another useful configurationwould be to add the heat pipe, refer to FIG. 1850, to move the ‘bulky’heat dissipation environment chamber away from the slender, lightweight, array assembly. In this configuration heat is immediatelytransferred from the LEDs through the substrate (1851) (either separatedor integral as discussed above), through the heat pipe (1852) and intothe heat dissipation environment chamber (1853). The heat dissipationenvironment chamber (1853) which allows the heat dissipation environmentmaterial (air, water, phase change heat effusion material, orcombination thereof) to simply absorb the heat while being stored in thechamber or may be circulated through the chamber between port (1854,1855).

[0066] Another configuration would separate the cathode from the anodenear the top or anode end of the LEDs. FIGS. 625, 650, and 675Illustrate such a configuration. Where 626, 651, and 676 represent anthin film of electrically insulating material, 627, 652, and 677represent a layer of electrically conductive material such as copper, orcopper plated with gold, 628, 653, and 678 represent the wire that wouldattach the LEDs' anode to the electrically conductive layer. The cathode(629, 654, and 679) is then bonded directly to the heat sinkmaterial/configuration (630, 655, and 680) utilizing heat andelectrically conductive adhesive producing a unique integral anode heatsink configuration. The circuits are then separated, where necessary, onthe top electrically conductive layer (627, 652, and 677). FIG. 1128illustrates ‘trenches’ (1131 and 1134) cut through the electricallyconductive layer (627, 652, and 677) into the electrically insulatingmaterial (626, 651, and 676). This configuration (1130) effectivelyproduces two, electrically separated circuits (1133 and 1135). Thisconfiguration allows to wire approximately ½ of the LEDs in parallelwith each other and the other half of the LEDs in parallel with eachother and then wire the halves in series, enabling the designer tomanage voltage and current. It also allows the designer to operate twodifferent types of LEDs that have different wavelength output and wouldrequire different currents and voltages to drive them optimally.

[0067] In some embodiments of the invention it is desired to modulatethe light output in order to obtain prescribed post cure physicalproperties from the composite. For more information on how thisaccomplished see U.S. Pat. No. 6,008,264 which is hereby incorporated byreference.

EXAMPLE A LIGHT EMITTING DIODE DENTAL CURING LIGHT SOURCE

[0068] Obtain a ½ inch diameter by approximately 2 inches in length barof alloy 110 copper from a source such as MSC Industrial Supply Co.,Melville, N.Y. Obtain a piece of copper clad G10 PCB stock from a sourcesuch as Precision Technology, Salt Lake City, Utah. Cut a piece of thecopper clad G10 approximately ¾ of an inch in diameter. Soldier the cutpiece of G10 to the end of alloy 110 copper bar stock. Have a machineshop such as Axis Machine, Salt Lake City, Utah machine the assemblyaccording to the specifications in FIGS. 1900, 1910, 1920, 1930, 1940.Take the machined assembly to a metal plating company such as QualityPlating Company, Salt Lake City, Utah and have the electrically platethe top conductive surface with gold according to mil spec G45204C.Further have them plate the reflective trenches with silver according tomil spec QQS365. Obtain 84-450 nanometer LEDs from Cree, Durham, N.C.,Part Number: C450CB290E1000, 65-430 nanometer LEDs from Cree, Durham,N.C., Part Number: C430CB290E1200. Send the LEDs, FIG. 1910 and FIG.1130 with instruction to set and wire bond the 430 nanometer LEDs to1132 and the 450 nanometer LEDs to 1131 using DM6030HK-SD/H569 SilverFilled Epoxy Paste (Diemat, Inc., Topsfield, Mass.) to a company likeLDX Optronix, Maryville, Tenn. Have a machine shop such as Axis Machine,Salt Lake City, Utah construct a heat sink according to thespecifications in FIGS. 2000, 2010, 2020, 2030. Obtain a ⅜ inch diameterby 6 inch length of heat pipe from a company such as ThermacoreInternational Inc., Lancaser, Pa. (Part Number HP-1 0.375×6.0). Attachthe heat pipe to the heat sink as illustrated in FIGS. 2100 and 2110using DM6030HK-SD/H569 Silver Filled Epoxy Paste (Diemat, Inc.,Topsfield, Mass.). Attach the LED array assembly completed by LDXOptronix to the other end of the heat pipe as illustrated in FIGS. 2100and 2110. Have a machine shop such as Axis Machine construct a housingout of a plastic material in accordance with the illustration in FIGS.2100 and 2110. Have a company such a KWM Electronics Corp., West Jordan,Utah manufacture 4 printed circuit according to the schematicspecification in FIGS. 2200, 2300, 2400 and 2500. Install the circuitscreated from FIGS. 2200 and 2300 into the handle (2101 and 2102respectively) as illustrated in FIG. 2100. Further install the circuitcreated from FIG. 2400 into the battery compartment (2103) asillustrated in FIG. 2100. The final circuit is mounted in a small kitbox available from any Radio Shack, Nationwide. At household 120 volt ACinput cord is installed and an output cord with the corresponding jackon the circuit produced by FIG. 2400 is also installed such that theoutput cord from the External Power Supply Assembly will plug into thecircuit created by FIG. 2400 which is installed in the batterycompartment. This enables the batteries to be recharged or the light tobe operated off of household 120 volt AC while the batteries are beingrecharged. Obtain 8-AA Nickle Metal Hydride batteries from a companysuch as DigiKey, Theif River Falls, Minn. and install them in thebattery compartment according to the illustration in FIG. 2100. Obtain asmall 12 volt DC fan from a company such as DigiKey, Theif River Falls,Minn. and install the fan in the heat dissipation environment chamber(2105) as illustrated in FIG. 2100. The device does not necessarily haveto have a fan. It could be run with natural air convection providing thecooling, water or a phase change heat effusion material such as sodiumSulfate Decahydrate, Aldrich Chemical Co., Milwaukee, Wis. In such aconfiguration the solid Sodium Sulfate Decahydrate would absorb the heatfrom the heat pipe and/or heat sink. As it absorbs the heat it convertsfrom a solid to a liquid (phase change) storing the heat. The heat couldthen be removed by convection or by way of a mechanical linkage,possibly in a ‘recharge station’ which would convert the sodium SulfateDecahydrate to a solid form again. Using any number of phase change heareffusion materials is very useful to the invention in that it eliminatesthe need for a fan which places additional current demand on thebatteries and circuitry, it also adds the noise of the fan to theenvironment where the light is used. In a configuration where waterprovides the heat dissipation environment, water could even be stored inthe chamber (2115) and re-circulated through the heat sink compartment,making the heat sink compartment and chamber 2115 the entire heatdissipation environment. Of course the water could be simply be pumpedthrough the environment and discarded through an input and output portconstructed in the chamber as well.

ADDITIONAL CONFIGURATION EXAMPLES

[0069] The basic concepts, designs, and circuitry of this example arenot strictly limited to the design of placing the LED array in theimmediate vicinity of the tooth. For instance it could be configuredsuch that the LED array is placed in the main housing and the light isdelivered by fiber optic or light guide as illustrated in FIG. 2600. TheLED array (2602) is mounted to the end of a heat pipe (2606) which isthen attached to a heat sink (2605), the heat sink being integrated alsoas the anode for the LEDs as described earlier. The Led Array (2602)produces light which passes through a lens, lens array or halographicfilm as discussed earlier. The light then passes into the light deliverydevice (2604) which could be a rigid light guide as portrayed in FIG.2600 or could be a single fiber or a bundle of fibers. The fancompartment (2601) could be filled with water, a phase change heateffusion material as illustrated in FIG. 2600 and discussed earlier orit could contain a fan for cooling.

[0070] The basic concepts, designs, and circuitry of this example arecertainly not limited to a certain configuration in housing design. FIG.2700 illustrates another potential ‘pistol’ type design whichincorporates the LED array close to the working surface while FIG. 2800illustrates another potential ‘pistol’ type design which incorporatesthe LED array within the housing utilizing a light delivery device toget the light to the work surface.

[0071] The basic concepts, designs, and circuitry of this example arecertainly not limited to an LED array of a certain size and for use indentistry only. FIG. 2900 illustrates a ‘pistol’ type device thatcontains an LED array (2901) approximately 3 times the diameter of theexample, which would contain approximately 5 times as many LEDs in thearray. The LED array uses an integral anode/heat sink configurationwhere the heat sink (2903) may or may not include a heat pipe (2902). Itcontains a cooling compartment (2904) which could house a fan, nothingat all, water, or a phase change heat effusion material or a combinationthereof. The heat dissipation environment could be stagnant orcirculating. It contains a space for circuitry (1905) and for batteries(2906) and could be operated by the electronic presented in schematicdetail earlier. A device such as the one illustrated in 2900 coulddesigned for use as a dental curing light, dental bleach activator,forensic light source to name but a few.

[0072]1. A Light Emitting Diode dental curing light source for curingdental composite materials comprising:

[0073] A first substrate composed of a material capable of efficientlyconducting heat and conducting electrical current, said substrate havinga top and a bottom

[0074] A plurality of cups located in said substrate top, at least someof said cups being sized and configured to have at least one lightemitting diode mounted therein

[0075] A plurality of light emitting diodes, said light emitting diodesbeing capable of emitting light when supplied with adequate electricalcurrent, at least some of said light emitting diodes being firmlymounted in said cups, said light emitting diodes being in thermalcommunication with said substrate so that heat produced by said lightemitting diodes is conducted away from said light emitting diodes

[0076] Electrical wiring configured to provide electrical current tosaid light emitting diodes in order to power them and cause them to emitlight

[0077] A heat pip capable of efficiently conducting heat from onlocation to another, said heat pipe have a proximal end and a distalend, said heat pipe proximal end being firmly mounted against said thebottom of said substrate in order to transfer heat from said substrateto said heat pipe's distal end,

[0078] A heat sink constructed of material capable of efficientlydissipating heat into the heat dissipation environment, said heat sinkhaving a top and bottom, said heat sink top being firmly attached todistal end of said heat pipe to accept and dissipate the heat from saiddistal end of said heat pipe

[0079] Control circuitry capable of controlling electrical currenttransmission to said light emitting diodes in order to control lightproduction by said light emitting diodes.

[0080] 2. A device as recited in claim 1 wherein said substrate isconstructed, in part, of diamond.

[0081] 3. A device as recited in claim I wherein said substrate isconstructed, in part, from a metal selected from the group containingcopper, aluminum, gold, silver, iron or combination thereof.

[0082] 4. A device as recited in claim 1 wherein said substrate isconstructed, in part, of a metal.

[0083] 5. A device as recited in claim I wherein said heat dissipationenvironment is air.

[0084] 6. A device as recited in claim I wherein said heat dissipationenvironment is water.

[0085] 7. A device as recited in claim 1 wherein said heat dissipationenvironment is a phase change heat effusion material.

[0086] 8. A device as recited in claim 1 wherein said cups in saidsubstrate are coated with a optically reflective material.

[0087] 9. A device as recited in claim I wherein said cups in saidsubstrate are coated with an optically reflective material selected fromthe group comprising rhodium, silver, platinum and gold.

[0088] 10. A device as recited in claim 1 wherein said cups in saidsubstrate have angled walls, curved walls, square walls or a combinationthereof.

[0089] 11. A device as recited in claim 1 wherein said heat sink isconstructed, at least in part, of metal.

[0090] 12. A device as recited in claim 1 wherein said heat sink isconstructed, at least in part, of aluminum.

[0091] 13. A device as recited in claim 1 wherein said heat pipe isconstructed, at least in part, of copper, water and a wick material.

[0092] 14. A device as recited in claim 1 wherein said heat pipe isconstructed, at least in part, of copper, alcohol and a wick material.

[0093] 15. A device as recited in claim I wherein said heat pipe isconstructed, at least in part, of metal, water and a wick material.

[0094] 16. A device as recited in claim 1 wherein said heat pipe isconstructed, at least in part, of metal, alcohol and a wick material.

[0095] 17. A device as recited in claim 1 wherein said substrate, heatpipe, and heat sink are electrically conductive and are integral,electrically with the anode of said light emitting diodes.

[0096] 18. A device as recited in claim 1 wherein said plurality oflight emitting diodes are comprised of light emitting diodes ofdifferent wavelengths.

[0097] 19. A device as recited in claim 1 wherein said plurality oflight emitting diodes produce light of wavelengths selected from thegroup 430 nanometer, 450 nanometer, 470 nanometer or combinationsthereof.

[0098] 20. A device as recited in claim 1 wherein said control circuitryand said electrical wiring includes batteries for operation of thedevice off of said batteries or a plug which allows the device to runoff of AC line current or a combination thereof.

[0099] 21. A Light Emitting Diode dental curing light source for curingdental composite materials comprising:

[0100] A first substrate composed of a material capable of efficientlyconducting heat and conducting electrical current, said substrate havinga top and a bottom

[0101] A plurality of light emitting diodes, said light emitting diodesbeing capable of emitting light when supplied with adequate electricalcurrent, at least some of said light emitting diodes being firmlymounted to said substrate, said light emitting diodes being in thermalcommunication with said substrate so that heat produced by said lightemitting diodes is conducted away from said light emitting diodes

[0102] Electrical wiring configured to provide electrical current tosaid light emitting diodes in order to power them and cause them to emitlight

[0103] A heat pipe capable of efficiently conducting heat from onlocation to another, said heat pipe have a proximal end and a distalend, said heat pipe proximal end being firmly mounted against said thebottom of said substrate in order to transfer heat from said substrateto said heat pipe's distal end,

[0104] A heat sink constructed of material capable of efficientlydissipating heat into the heat dissipation environment, said heat sinkhaving a top and bottom, said heat sink top being firmly attached todistal end of said heat pipe to accept and dissipate the heat from saiddistal end of said heat pipe

[0105] Control circuitry capable of controlling electrical currenttransmission to said light emitting diodes in order to control lightproduction by said light emitting diodes.

[0106] 22. A device as recited in claim 21 wherein said substrate isconstructed, in part, of diamond.

[0107] 23. A device as recited in claim 21 wherein said substrate isconstructed, in part, from a metal selected from the group containingcopper, aluminum, gold, silver, iron or combination thereof.

[0108] 24. A device as recited in claim 21 wherein said substrate isconstructed, in part, of a metal.

[0109] 25. A device as recited in claim 21 wherein said heat dissipationenvironment is air.

[0110] 26. A device as recited in claim 21 wherein said heat dissipationenvironment is water.

[0111] 27. A device as recited in claim 21 wherein said heat dissipationenvironment is a phase change heat effusion material.

[0112] 28. A device as recited in claim 21 wherein said heat sink isconstructed, at least in part, of metal.

[0113] 29. A device as recited in claim 21 wherein said heat sink isconstructed, at least in part, of aluminum.

[0114] 30. A device as recited in claim 21 wherein said heat pipe isconstructed, at least in part, of copper, water and a wick material.

[0115] 31. A device as recited in claim 21 wherein said heat pipe isconstructed, at least in part, of copper, alcohol and a wick material.

[0116] 32. A device as recited in claim 21 wherein said heat pipe isconstructed, at least in part, of metal, water and a wick material.

[0117] 33. A device as recited in claim 21 wherein said heat pipe isconstructed, at least in part, of metal, alcohol and a wick material.

[0118] 34. A device as recited in claim 21 wherein said substrate, heatpipe, and heat sink are electrically conductive and are integral,electrically, with the anode of said light emitting diodes.

[0119] 35. A device as recited in claim 21 wherein said plurality oflight emitting diodes are comprised of light emitting diodes ofdifferent wavelengths.

[0120] 36. A device as recited in claim 21 wherein said plurality oflight emitting diodes produce light of wavelengths selected from thegroup 430 nanometer, 450 nanometer, 470 nanometer or combinationsthereof.

[0121] 37. A device as recited in claim 21 wherein said controlcircuitry and said electrical wiring includes batteries for operation ofthe device off of said batteries or a plag which allows the device torun off of AC line current or a combination thereof.

[0122] 38. A Light Emitting Diode dental curing light source for curingdental composite materials comprising:

[0123] A first substrate composed of a material capable of efficientlyconducting heat and conducting electrical current, said substrate havinga top and a bottom

[0124] A plurality of cups located in said substrate top, at least someof said cups being sized and configured to have at least one lightemitting diode mounted therein

[0125] A plurality of light emitting diodes, said light emitting diodesbeing capable of emitting light when supplied with adequate electricalcurrent, at least some of said light emitting diodes being firmlymounted in said cups, said light emitting diodes being in thermalcommunication with said substrate so that heat produced by said lightemitting diodes is conducted away from said light emitting diodes

[0126] A lens or plurality of lenses used to collect, focus and orcollimate the light being emitted by said light emitting diodes,

[0127] Electrical wiring configured to provide electrical current tosaid light emitting diodes in order to power them and cause them to emitlight

[0128] A heat pipe capable of efficiently conducting heat from onlocation to another, said heat pipe have a proximal end and a distalend, said heat pipe proximal end being firmly mounted against said thebottom of said substrate in order to transfer heat from said substrateto said heat pipe's distal end,

[0129] A heat sink constructed of material capable of efficientlydissipating heat into the heat dissipation environment, said heat sinkhaving a top and bottom, said heat sink top being firmly attached todistal end of said heat pipe to accept and dissipate the heat from saiddistal end of said heat pipe

[0130] Control circuitry capable of controlling electrical currenttransmission to said light emitting diodes in order to control lightproduction by said light emitting diodes.

[0131] 39. A device as recited in claim 38 wherein said controlcircuitry and said electrical wiring include batteries for operation ofthe device off of said batteries or a plug which allows the device torun off of AC line current or a combination thereof.

[0132] 40. A device as recited in claim 38 wherein said substrate isconstructed, in part, of diamond.

[0133] 41. A device as recited in claim 38 wherein said substrate isconstructed, in part, from a metal selected from the group containingcopper, aluminum, gold, silver, iron or combination thereof.

[0134] 42. A device as recited in claim 38 wherein said substrate isconstructed, in part, of a metal.

[0135] 43. A device as recited in claim 38 wherein said heat dissipationenvironment is air.

[0136] 44. A device as recited in claim 38 wherein said heat dissipationenvironment is water.

[0137] 45. A device as recited in claim 38 wherein said heat dissipationenvironment is a phase change heat effusion material.

[0138] 46. A device as recited in claim 38 wherein said cups in saidsubstrate are coated with a optically reflective material.

[0139] 47. A device as recited in claim 38 wherein said cups in saidsubstrate are coated with an optically reflective material selected fromthe group comprising rhodium, silver, platinum and gold.

[0140] 48. A device as recited in claim 38 wherein said cups in saidsubstrate have angled walls, curved walls, square walls or a combinationthereof.

[0141] 49. A device as recited in claim 38 wherein said heat sink isconstructed, at least in part, of metal.

[0142] 50. A device as recited in claim 38 wherein said heat sink isconstructed, at least in part, of aluminum.

[0143] 51. A device as recited in claim 38 wherein said heat pipe isconstructed, at least in part, of copper, water and a wick material.

[0144] 52. A device as recited in claim 38 wherein said heat pipe isconstructed, at least in part, of copper, alcohol and a wick material.

[0145] 53. A device as recited in claim 38 wherein said heat pipe isconstructed, at least in part, of metal, water and a wick material.

[0146] 54. A device as recited in claim 38 wherein said heat pipe isconstructed, at least in part, of metal, alcohol and a wick material.

[0147] 55. A device as recited in claim 38 wherein said substrate, heatpipe, and heat sink are electrically conductive and are integral,electrically with the anode of said light emitting diodes.

[0148] 56. A device as recited in claim 38 wherein said plurality oflight emitting diodes are comprised of light emitting diodes ofdifferent wavelengths.

[0149] 57. A device as recited in claim 38 wherein said plurality oflight emitting diodes produce light of wavelengths selected from thegroup 430 nanometer, 450 nanometer, 470 nanometer or combinationsthereof.

[0150] 58. A device as recited in claim 38 wherein said lens or saidplurality of lenses are constructed from a group of materials comprisingglass, plastic, holographic film or combinations thereof.

[0151] 57. A Light Emitting Diode dental curing light source for curingdental composite materials comprising:

[0152] A first substrate composed of a material capable of efficientlyconducting heat and conducting electrical current, said substrate havinga top and a bottom

[0153] A plurality of cups located in said substrate top, at least someof said cups being sized and configured to have at least one lightemitting diode mounted therein

[0154] A plurality of light emitting diodes, said light emitting diodesbeing capable of emitting light when supplied with adequate electricalcurrent, at least some of said light emitting diodes being firmlymounted in said cups, said light emitting diodes being in thermalcommunication with said substrate so that heat produced by said lightemitting diodes is conducted away from said light emitting diodes

[0155] Electrical wiring configured to provide electrical current tosaid light emitting diodes in order to power them and cause them to emitlight

[0156] A heat sink constructed of material capable of efficientlydissipating heat into the heat dissipation environment, said heat sinkhaving a top and bottom, said heat sink top being firmly attached tobottom of said substrate to accept and dissipate the heat from saidsubstrate.

[0157] Control circuitry capable of controlling electrical currenttransmission to said light emitting diodes in order to control lightproduction by said light emitting diodes.

[0158] 58. A device as recited in claim 57 wherein said substrate isconstructed, in part, of diamond.

[0159] 59. A device as recited in claim 57 wherein said substrate isconstructed, in part, from a metal selected from the group containingcopper, aluminum, gold, silver, iron or combination thereof.

[0160] 60. A device as recited in claim 57 wherein said substrate isconstructed, in part, of a metal.

[0161] 61. A device as recited in claim 57 wherein said heat dissipationenvironment is air.

[0162] 62. A device as recited in claim 57 wherein said heat dissipationenvironment is water.

[0163] 63. A device as recited in claim 57 wherein said heat dissipationenvironment is a phase change heat effusion material.

[0164] 64. A device as recited in claim 57 wherein said cups in saidsubstrate are coated with a optically reflective material.

[0165] 65. A device as recited in claim 57 wherein said cups in saidsubstrate are coated with an optically reflective material selected fromthe group comprising rhodium, silver, platinum and gold.

[0166] 66. A device as recited in claim 57 wherein said cups in saidsubstrate have angled walls, curved walls, square walls or a combinationthereof.

[0167] 67. A device as recited in claim 57 wherein said heat sink isconstructed, at least in part, of metal.

[0168] 68. A device as recited in claim 57 wherein said heat sink isconstructed, at least in part, of aluminum.

[0169] 69. A device as recited in claim 57 wherein said substrate andheat sink are electrically conductive, are one piece, constructed of thesame material and are integral, electrically with the anode of saidlight emitting diodes.

[0170] 70. A device as recited in claim 57 wherein said plurality oflight emitting diodes are comprised of light emitting diodes ofdifferent wavelengths.

[0171] 71. A device as recited in claim 57 wherein said plurality oflight emitting diodes produce light of wavelengths selected from thegroup 430 nanometer, 450 nanometer, 470 nanometer or combinationsthereof.

[0172] 72. A device as recited in claim 57 wherein said controlcircuitry and said electrical wiring include batteries for operation ofthe device off of said batteries or a plug which allows the device torun off of AC line current or a combination thereof.

[0173] 73. A Light Emitting Diode dental curing light source for curingdental composite materials comprising:

[0174] A first substrate composed of a material capable of efficientlyconducting heat and conducting electrical current, said substrate havinga top and a bottom

[0175] A plurality of light emitting diodes, said light emitting diodesbeing capable of emitting light when supplied with adequate electricalcurrent, at least some of said light emitting diodes being firmlymounted to said substrate, said light emitting diodes being in thermalcommunication with said substrate so that heat produced by said lightemitting diodes is conducted away from said light emitting diodes

[0176] Electrical wiring configured to provide electrical current tosaid light emitting diodes in order to power them and cause them to emitlight

[0177] A heat sink constructed of material capable of efficientlydissipating heat into the heat dissipation environment, said heat sinkhaving a top and bottom, said heat sink top being firmly attached tobottom of said substrate to accept and dissipate the heat from saidsubstrate.

[0178] Control circuitry capable of controlling electrical currenttransmission to said light emitting diodes in order to control lightproduction by said light emitting diodes.

[0179] 74. A device as recited in claim 73 wherein said substrate isconstructed, in part, of diamond.

[0180] 75. A device as recited in claim 73 wherein said substrate isconstructed, in part, from a metal selected from the group containingcopper, aluminum, gold, silver, iron or combination thereof.

[0181] 76. A device as recited in claim 73 wherein said substrate isconstructed, in part, of a metal.

[0182] 77. A device as recited in claim 73 wherein said heat dissipationenvironment is air.

[0183] 78. A device as recited in claim 73 wherein said heat dissipationenvironment is water.

[0184] 79. A device as recited in claim 73 wherein said heat dissipationenvironment is a phase change heat effusion material.

[0185] 80. A device as recited in claim 73 wherein said heat sink isconstructed, at least in part, of metal.

[0186] 81. A device as recited in claim 73 wherein said heat sink isconstructed, at least in part, of aluminum.

[0187] 82. A device as recited in claim 73 wherein said substrate andheat sink are electrically conductive, consturcted in one piece from thesame material and are integral, electrically, with the anode of saidlight emitting diodes.

[0188] 83. A device as recited in claim 73 wherein said plurality oflight emitting diodes are comprised of light emitting diodes ofdifferent wavelengths.

[0189] 84. A device as recited in claim 73 wherein said plurality oflight emitting diodes produce light of wavelengths selected from thegroup 430 nanometer, 450 nanometer, 470 nanometer or combinationsthereof.

[0190] 85. A device as recited in claim 73 wherein said controlcircuitry and said electrical wiring include batteries for operation ofthe device off of said batteries or a plug which allows the device torun of AC line current or a combination thereof.

[0191] 86. A Light Emitting Diode dental curing light source for curingdental composite materials comprising:

[0192] A first substrate composed of a material capable of efficientlyconducting heat and conducting electrical current, said substrate havinga top and a bottom

[0193] A plurality of cups located in said substrate top, at least someof said cups being sized and configured to have at least one lightemitting diode mounted therein

[0194] A plurality of light emitting diodes, said light emitting diodesbeing capable of emitting light when supplied with adequate electricalcurrent, at least some of said light emitting diodes being firmlymounted in said cups, said light emitting diodes being in thermalcommunication with said substrate so that heat produced by said lightemitting diodes is conducted away from said light emitting diodes

[0195] A lens or plurality of lenses used to collect, focus and orcollimate the light being emitted by said light emitting diodes,

[0196] Electrical wiring configured to provide electrical current tosaid light emitting diodes in order to power them and cause them to emitlight

[0197] A heat sink constructed of material capable of efficientlydissipating heat into the heat dissipation environment, said heat sinkhaving a top and bottom, said heat sink top being firmly attached tosaid bottom of said substrate to accept and dissipate the heat from saidbottom of said substrate

[0198] Control circuitry capable of controlling electrical currenttransmission to said light emitting diodes in order to control lightproduction by said light emitting diodes.

[0199] 87. A device as recited in claim 86 wherein said controlcircuitry and said electrical wiring include batteries for operation ofthe device off of said batteries or a plug which allows the device torun off of AC line current or a combination thereof.

[0200] 88. A device as recited in claim 86 wherein said substrate isconstructed, in part, of diamond.

[0201] 89. A device as recited in claim 86 wherein said substrate isconstructed, in part, from a metal selected from the group containingcopper, aluminum, gold, silver, iron or combination thereof.

[0202] 90. A device as recited in claim 86 wherein said substrate isconstructed, in part, of a metal.

[0203] 91. A device as recited in claim 86 wherein said heat dissipationenvironment is air.

[0204] 92. A device as recited in claim 86 wherein said heat dissipationenvironment is water.

[0205] 93. A device as recited in claim 86 wherein said heat dissipationenvironment is a phase change heat effusion material.

[0206] 94. A device as recited in claim 86 wherein said cups in saidsubstrate are coated with a optically reflective material.

[0207] 95. A device as recited in claim 86 wherein said cups in saidsubstrate are coated with an optically reflective material selected fromthe group comprising rhodium, silver, platinum and gold.

[0208] 96. A device as recited in claim 86 wherein said cups in saidsubstrate have angled walls, curved walls, square walls or a combinationthereof.

[0209] 97. A device as recited in claim 86 wherein said heat sink isconstructed, at least in part, of metal.

[0210] 98. A device as recited in claim 86 wherein said heat sink isconstructed, at least in part, of aluminum.

[0211] 99. A device as recited in claim 86 wherein said substrate andheat sink are electrically conductive, one piece, constructed of thesame material, and are integral, electrically with the anode of saidlight emitting diodes.

[0212] 100. A device as recited in claim 86 wherein said plurality oflight emitting diodes are comprised of light emitting diodes ofdifferent wavelengths.

[0213] 101. A device as recited in claim 86 wherein said plurality oflight emitting diodes produce light of wavelengths selected from thegroup 430 nanometer, 450 nanometer, 470 nanometer or combinationsthereof.

[0214] 102. A device as recited in claim 86 wherein said lens or saidplurality of lenses are constructed from a group of materials comprisingglass, plastic, holographic film or combinations thereof.

[0215] The basic concepts, designs, and circuitry of this example neednot be limited to ‘pistol’ type designs. FIG. 3000 illustrates theability of the concepts to be incorporated in a ‘flashlight’ designwhich contains all of the basic elements of the invention: an LED array(3001), with or without a lens, lens array, halographic film, lightdelivery device or combination thereof, a heat sink (3003) which couldor could not also be the anode, the heat sink may or may not incorporatea heat pipe (3003), the housing includes a space for electronic (3005),batteries (3005), and a cooling compartment (3007)

[0216] None of the overall designs necessarily have to have a batterycompartment. The invention could be run completely on AC power.

[0217] The foregoing description and drawings are illustrative ofpreferred embodiments of the invention and are not intended to belimiting of the invention's scope. The scope of the invention is definedby the appended claims, which should be interpreted to cover that whichis disclosed herein and equivalents thereof.

What is claimed is:
 1. A Light Emitting Diode dental curing light source for curing dental composite materials comprising: A first substrate composed of a material capable of efficiently conducting heat and conducting electrical current, said substrate having a top and a bottom A plurality of cups located in said substrate top, at least some of said cups being sized and configured to have at least one light emitting diode mounted therein A plurality of light emitting diodes, said light emitting diodes being capable of emitting light when supplied with adequate electrical current, at least some of said light emitting diodes being firmly mounted in said cups, said light emitting diodes being in thermal communication with said substrate so that heat produced by said light emitting diodes is conducted away from said light emitting diodes Electrical wiring configured to provide electrical current to said light emitting diodes in order to power them and cause them to emit light A heat pip capable of efficiently conducting heat from on location to another, said heat pipe have a proximal end and a distal end, said heat pipe proximal end being firmly mounted against said the bottom of said substrate in order to transfer heat from said substrate to said heat pipe's distal end, A heat sink constructed of material capable of efficiently dissipating heat into the heat dissipation environment, said heat sink having a top and bottom, said heat sink top being firmly attached to distal end of said heat pipe to accept and dissipate the heat from said distal end of said heat pipe Control circuitry capable of controlling electrical current transmission to said light emitting diodes in order to control light production by said light emitting diodes.
 2. A device as recited in claim 1 wherein said substrate is constructed, in part, of diamond.
 3. A device as recited in claim 1 wherein said substrate is constructed, in part, from a metal selected from the group containing copper, aluminum, gold, silver, iron or combination thereof.
 4. A device as recited in claim 1 wherein said substrate is constructed, in part, of a metal.
 5. A device as recited in claim 1 wherein said heat dissipation environment is air.
 6. A device as recited in claim 1 wherein said heat dissipation environment is water.
 7. A device as recited in claim 1 wherein said heat dissipation environment is a phase change heat effusion material.
 8. A device as recited in claim 1 wherein said cups in said substrate are coated with a optically reflective material.
 9. A device as recited in claim 1 wherein said cups in said substrate are coated with an optically reflective material selected from the group comprising rhodium, silver, platinum and gold.
 10. A device as recited in claim 1 wherein said cups in said substrate have angled walls, curved walls, square walls or a combination thereof.
 11. A device as recited in claim 1 wherein said heat sink is constructed, at least in part, of metal.
 12. A device as recited in claim 1 wherein said heat sink is constructed, at least in part, of aluminum.
 13. A device as recited in claim 1 wherein said heat pipe is constructed, at least in part, of copper, water and a wick material.
 14. A device as recited in claim 1 wherein said heat pipe is constructed, at least in part, of copper, alcohol and a wick material.
 15. A device as recited in claim 1 wherein said heat pipe is constructed, at least in part, of metal, water and a wick material.
 16. A device as recited in claim 1 wherein said heat pipe is constructed, at least in part, of metal, alcohol and a wick material.
 17. A device as recited in claim 1 wherein said substrate, heat pipe, and heat sink are electrically conductive and are integral, electrically with the anode of said light emitting diodes.
 18. A device as recited in claim 1 wherein said plurality of light emitting diodes are comprised of light emitting diodes of different wavelengths.
 19. A device as recited in claim 1 wherein said plurality of light emitting diodes produce light of wavelengths selected from the group 430 nanometer, 450 nanometer, 470 nanometer or combinations thereof.
 20. A device as recited in claim 1 wherein said control circuitry and said electrical wiring includes batteries for operation of the device off of said batteries or a plug which allows the device to run off of AC line current or a combination thereof.
 21. A Light Emitting Diode dental curing light source for curing dental composite materials comprising: A first substrate composed of a material capable of efficiently conducting heat and conducting electrical current, said substrate having a top and a bottom A plurality of light emitting diodes, said light emitting diodes being capable of emitting light when supplied with adequate electrical current, at least some of said light emitting diodes being firmly mounted to said substrate, said light emitting diodes being in thermal communication with said substrate so that heat produced by said light emitting diodes is conducted away from said light emitting diodes Electrical wiring configured to provide electrical current to said light emitting diodes in order to power them and cause them to emit light A heat pipe capable of efficiently conducting heat from on location to another, said heat pipe have a proximal end and a distal end, said heat pipe proximal end being firmly mounted against said the bottom of said substrate in order to transfer heat from said substrate to said heat pipe's distal end, A heat sink constructed of material capable of efficiently dissipating heat into the heat dissipation environment, said heat sink having a top and bottom, said heat sink top being firmly attached to distal end of said heat pipe to accept and dissipate the heat from said distal end of said heat pipe Control circuitry capable of controlling electrical current transmission to said light emitting diodes in order to control light production by said light emitting diodes.
 22. A device as recited in claim 21 wherein said substrate is constructed, in part, of diamond.
 23. A device as recited in claim 21 wherein said substrate is constructed, in part, from a metal selected from the group containing copper, aluminum, gold, silver, iron or combination thereof.
 24. A device as recited in claim 21 wherein said substrate is constructed, in part, of a metal.
 25. A device as recited in claim 21 wherein said heat dissipation environment is air.
 26. A device as recited in claim 21 wherein said heat dissipation environment is water.
 27. A device as recited in claim 21 wherein said heat dissipation environment is a phase change heat effusion material.
 28. A device as recited in claim 21 wherein said heat sink is constructed, at least in part, of metal.
 29. A device as recited in claim 21 wherein said heat sink is constructed, at least in part, of aluminum.
 30. A device as recited in claim 21 wherein said heat pipe is constructed, at least in part, of copper, water and a wick material.
 31. A device as recited in claim 21 wherein said heat pipe is constructed, at least in part, of copper, alcohol and a wick material.
 32. A device as recited in claim 21 wherein said heat pipe is constructed, at least in part, of metal, water and a wick material.
 33. A device as recited in claim 21 wherein said heat pipe is constructed, at least in part, of metal, alcohol and a wick material.
 34. A device as recited in claim 21 wherein said substrate, heat pipe, and heat sink are electrically conductive and are integral, electrically, with the anode of said light emitting diodes.
 35. A device as recited in claim 21 wherein said plurality of light emitting diodes are comprised of light emitting diodes of different wavelengths.
 36. A device as recited in claim 21 wherein said plurality of light emitting diodes produce light of wavelengths selected from the group 430 nanometer, 450 nanometer, 470 nanometer or combinations thereof.
 37. A device as recited in claim 21 wherein said control circuitry and said electrical wiring includes batteries for operation of the device off of said batteries or a plag which allows the device to run off of AC line current or a combination thereof.
 38. A Light Emitting Diode dental curing light source for curing dental composite materials comprising: A first substrate composed of a material capable of efficiently conducting heat and conducting electrical current, said substrate having a top and a bottom A plurality of cups located in said substrate top, at least some of said cups being sized and configured to have at least one light emitting diode mounted therein A plurality of light emitting diodes, said light emitting diodes being capable of emitting light when supplied with adequate electrical current, at least some of said light emitting diodes being firmly mounted in said cups, said light emitting diodes being in thermal communication with said substrate so that heat produced by said light emitting diodes is conducted away from said light emitting diodes A lens or plurality of lenses used to collect, focus and or collimate the light being emitted by said light emitting diodes, Electrical wiring configured to provide electrical current to said light emitting diodes in order to power them and cause them to emit light A heat pipe capable of efficiently conducting heat from on location to another, said heat pipe have a proximal end and a distal end, said heat pipe proximal end being firmly mounted against said the bottom of said substrate in order to transfer heat from said substrate to said heat pipe's distal end, A heat sink constructed of material capable of efficiently dissipating heat into the heat dissipation environment, said heat sink having a top and bottom, said heat sink top being firmly attached to distal end of said heat pipe to accept and dissipate the heat from said distal end of said heat pipe Control circuitry capable of controlling electrical current transmission to said light emitting diodes in order to control light production by said light emitting diodes.
 39. A device as recited in claim 38 wherein said control circuitry and said electrical wiring include batteries for operation of the device off of said batteries or a plug which allows the device to run off of AC line current or a combination thereof.
 40. A device as recited in claim 38 wherein said substrate is constructed, in part, of diamond.
 41. A device as recited in claim 38 wherein said substrate is constructed, in part, from a metal selected from the group containing copper, aluminum, gold, silver, iron or combination thereof.
 42. A device as recited in claim 38 wherein said substrate is constructed, in part, of a metal.
 43. A device as recited in claim 38 wherein said heat dissipation environment is air.
 44. A device as recited in claim 38 wherein said heat dissipation environment is water.
 45. A device as recited in claim 38 wherein said heat dissipation environment is a phase change heat effusion material.
 46. A device as recited in claim 38 wherein said cups in said substrate are coated with a optically reflective material.
 47. A device as recited in claim 38 wherein said cups in said substrate are coated with an optically reflective material selected from the group comprising rhodium, silver, platinum and gold.
 48. A device as recited in claim 38 wherein said cups in said substrate have angled walls, curved walls, square walls or a combination thereof.
 49. A device as recited in claim 38 wherein said heat sink is constructed, at least in part, of metal.
 50. A device as recited in claim 38 wherein said heat sink is constructed, at least in part, of aluminum.
 51. A device as recited in claim 38 wherein said heat pipe is constructed, at least in part, of copper, water and a wick material.
 52. A device as recited in claim 38 wherein said heat pipe is constructed, at least in part, of copper, alcohol and a wick material.
 53. A device as recited in claim 38 wherein said heat pipe is constructed, at least in part, of metal, water and a wick material.
 54. A device as recited in claim 38 wherein said heat pipe is constructed, at least in part, of metal, alcohol and a wick material.
 55. A device as recited in claim 38 wherein said substrate, heat pipe, and heat sink are electrically conductive and are integral, electrically with the anode of said light emitting diodes.
 56. A device as recited in claim 38 wherein said plurality of light emitting diodes are comprised of light emitting diodes of different wavelengths.
 57. A device as recited in claim 38 wherein said plurality of light emitting diodes produce light of wavelengths selected from the group 430 nanometer, 450 nanometer, 470 nanometer or combinations thereof.
 58. A device as recited in claim 38 wherein said lens or said plurality of lenses are constructed from a group of materials comprising glass, plastic, holographic film or combinations thereof.
 57. A Light Emitting Diode dental curing light source for curing dental composite materials comprising: A first substrate composed of a material capable of efficiently conducting heat and conducting electrical current, said substrate having a top and a bottom A plurality of cups located in said substrate top, at least some of said cups being sized and configured to have at least one light emitting diode mounted therein A plurality of light emitting diodes, said light emitting diodes being capable of emitting light when supplied with adequate electrical current, at least some of said light emitting diodes being firmly mounted in said cups, said light emitting diodes being in thermal communication with said substrate so that heat produced by said light emitting diodes is conducted away from said light emitting diodes Electrical wiring configured to provide electrical current to said light emitting diodes in order to power them and cause them to emit light A heat sink constructed of material capable of efficiently dissipating heat into the heat dissipation environment, said heat sink having a top and bottom, said heat sink top being firmly attached to bottom of said substrate to accept and dissipate the heat from said substrate, Control circuitry capable of controlling electrical current transmission to said light emitting diodes in order to control light production by said light emitting diodes.
 58. A device as recited in claim 57 wherein said substrate is constructed, in part, of diamond.
 59. A device as recited in claim 57 wherein said substrate is constructed, in part, from a metal selected from the group containing copper, aluminum, gold, silver, iron or combination thereof.
 60. A device as recited in claim 57 wherein said substrate is constructed, in part, of a metal.
 61. A device as recited in claim 57 wherein said heat dissipation environment is air.
 62. A device as recited in claim 57 wherein said heat dissipation environment is water.
 63. A device as recited in claim 57 wherein said heat dissipation environment is a phase change heat effusion material.
 64. A device as recited in claim 57 wherein said cups in said substrate are coated with a optically reflective material.
 65. A device as recited in claim 57 wherein said cups in said substrate are coated with an optically reflective material selected from the group comprising rhodium, silver, platinum and gold.
 66. A device as recited in claim 57 wherein said cups in said substrate have angled walls, curved walls, square walls or a combination thereof.
 67. A device as recited in claim 57 wherein said heat sink is constructed, at least in part, of metal.
 68. A device as recited in claim 57 wherein said heat sink is constructed, at least in part, of aluminum.
 69. A device as recited in claim 57 wherein said substrate and heat sink are electrically conductive, are one piece, constructed of the same material and are integral, electrically with the anode of said light emitting diodes.
 70. A device as recited in claim 57 wherein said plurality of light emitting diodes are comprised of light emitting diodes of different wavelengths.
 71. A device as recited in claim 57 wherein said plurality of light emitting diodes produce light of wavelengths selected from the group 430 nanometer, 450 nanometer, 470 nanometer or combinations thereof.
 72. A device as recited in claim 57 wherein said control circuitry and said electrical wiring include batteries for operation of the device off of said batteries or a plug which allows the device to run off of AC line current or a combination thereof.
 73. A Light Emitting Diode dental curing light source for curing dental composite materials comprising: A first substrate composed of a material capable of efficiently conducting heat and conducting electrical current, said substrate having a top and a bottom A plurality of light emitting diodes, said light emitting diodes being capable of emitting light when supplied with adequate electrical current, at least some of said light emitting diodes being firmly mounted to said substrate, said light emitting diodes being in thermal communication with said substrate so that heat produced by said light emitting diodes is conducted away from said light emitting diodes Electrical wiring configured to provide electrical current to said light emitting diodes in order to power them and cause them to emit light A heat sink constructed of material capable of efficiently dissipating heat into the heat dissipation environment, said heat sink having a top and bottom, said heat sink top being firmly attached to bottom of said substrate to accept and dissipate the heat from said substrate, Control circuitry capable of controlling electrical current transmission to said light emitting diodes in order to control light production by said light emitting diodes.
 74. A device as recited in claim 73 wherein said substrate is constructed, in part, of diamond.
 75. A device as recited in claim 73 wherein said substrate is constructed, in part, from a metal selected from the group containing copper, aluminum, gold, silver, iron or combination thereof.
 76. A device as recited in claim 73 wherein said substrate is constructed, in part, of a metal.
 77. A device as recited in claim 73 wherein said heat dissipation environment is air.
 78. A device as recited in claim 73 wherein said heat dissipation environment is water.
 79. A device as recited in claim 73 wherein said heat dissipation environment is a phase change heat effusion material.
 80. A device as recited in claim 73 wherein said heat sink is constructed, at least in part, of metal.
 81. A device as recited in claim 73 wherein said heat sink is constructed, at least in part, of aluminum.
 82. A device as recited in claim 73 wherein said substrate and heat sink are electrically conductive, consturcted in one piece from the same material and are integral, electrically, with the anode of said light emitting diodes.
 83. A device as recited in claim 73 wherein said plurality of light emitting diodes are comprised of light emitting diodes of different wavelengths.
 84. A device as recited in claim 73 wherein said plurality of light emitting diodes produce light of wavelengths selected from the group 430 nanometer, 450 nanometer, 470 nanometer or combinations thereof.
 85. A device as recited in claim 73 wherein said control circuitry and said electrical wiring include batteries for operation of the device off of said batteries or a plug which allows the device to run of AC line current or a combination thereof.
 86. A Light Emitting Diode dental curing light source for curing dental composite materials comprising: A first substrate composed of a material capable of efficiently conducting heat and conducting electrical current, said substrate having a top and a bottom A plurality of cups located in said substrate top, at least some of said cups being sized and configured to have at least one light emitting diode mounted therein A plurality of light emitting diodes, said light emitting diodes being capable of emitting light when supplied with adequate electrical current, at least some of said light emitting diodes being firmly mounted in said cups, said light emitting diodes being in thermal communication with said substrate so that heat produced by said light emitting diodes is conducted away from said light emitting diodes A lens or plurality of lenses used to collect, focus and or collimate the light being emitted by said light emitting diodes, Electrical wiring configured to provide electrical current to said light emitting diodes in order to power them and cause them to emit light A heat sink constructed of material capable of efficiently dissipating heat into the heat dissipation environment, said heat sink having a top and bottom, said heat sink top being firmly attached to said bottom of said substrate to accept and dissipate the heat from said bottom of said substrate Control circuitry capable of controlling electrical current transmission to said light emitting diodes in order to control light production by said light emitting diodes.
 87. A device as recited in claim 86 wherein said control circuitry and said electrical wiring include batteries for operation of the device off of said batteries or a plug which allows the device to run off of AC line current or a combination thereof.
 88. A device as recited in claim 86 wherein said substrate is constructed, in part, of diamond.
 89. A device as recited in claim 86 wherein said substrate is constructed, in part, from a metal selected from the group containing copper, aluminum, gold, silver, iron or combination thereof.
 90. A device as recited in claim 86 wherein said substrate is constructed, in part, of a metal.
 91. A device as recited in claim 86 wherein said heat dissipation environment is air.
 92. A device as recited in claim 86 wherein said heat dissipation environment is water.
 93. A device as recited in claim 86 wherein said heat dissipation environment is a phase change heat effusion material.
 94. A device as recited in claim 86 wherein said cups in said substrate are coated with a optically reflective material.
 95. A device as recited in claim 86 wherein said cups in said substrate are coated with an optically reflective material selected from the group comprising rhodium, silver, platinum and gold.
 96. A device as recited in claim 86 wherein said cups in said substrate have angled walls, curved walls, square walls or a combination thereof.
 97. A device as recited in claim 86 wherein said heat sink is constructed, at least in part, of metal.
 98. A device as recited in claim 86 wherein said heat sink is constructed, at least in part, of aluminum.
 99. A device as recited in claim 86 wherein said substrate and heat sink are electrically conductive, one piece, constructed of the same material, and are integral, electrically with the anode of said light emitting diodes.
 100. A device as recited in claim 86 wherein said plurality of light emitting diodes are comprised of light emitting diodes of different wavelengths.
 101. A device as recited in claim 86 wherein said plurality of light emitting diodes produce light of wavelengths selected from the group 430 nanometer, 450 nanometer, 470 nanometer or combinations thereof.
 102. A device as recited in claim 86 wherein said lens or said plurality of lenses are constructed from a group of materials comprising glass, plastic, holographic film or combinations thereof. 